KS Instrument Equipment

​​​​​​​​​​​​​​​​​​​​​One-stop Lab Equipment

Dual-target magnetron sputtering coating instrument

Model number  :KS-MSC-180S-DC/RF

 

​​​​​​​Application :The dual-target magnetron sputtering coating instrument can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, polytetrafluoroethylene films, etc.

 

 

 

 

 

 

Plasma sputtering coating instrument i

Model number : KS-PSC-180Q-DC   

 

 Application scope: Can be used for metal sputtering coating, especially suitable for coating of metals such as gold, silver and copper.题-双击进行编辑

​​​​​​  Introduction : The laboratory plasma cleaning machine ionizes working gases such as argon, oxygen, and nitrogen through high-frequency electric fields or microwaves to form plasma. The high-energy particles in the plasma collide with the surface of the object to be cleaned, causing physical bombardment, which removes the contaminants on the surface. At the same time, the plasma also reacts chemically with the surface contaminants, generating volatile substances, thereby achieving surface cleaning.

5L plasma cleaner 500W/1000W

1200 ℃ Atmosphere Furnace

Technical parameters:

Name 1200 ℃ Box type atmosphere furnace
Product Model KS-MFAS1200
Furnace chamber size 100mm wide × 100mm high × 100mm deep ~ 500mm wide * 500mm high * 500mm deep (size can be customized)
Maximum temperature 1200 ℃
Working temperature 1100 ℃
Heating speed 0-20 ℃(recommended10℃/min)
Temperature control 50 programmable and PID automatic control
Temperature uniformity ±5 ℃
Heating element Resistance wire
Thermocouple Type K
Furnace shell structure double furnace shell and equipped with cooling fan
Air vent Inert gases such as nitrogen and argon. Reducing gases are prohibited
Vacuum degree -0.1Mpa
Voltage AC220V/380,50/60Hz
Product introduction: Box-type atmosphere furnace through pre-vacuum, to ensure that the oxygen content in the furnace to a minimum, and then through the nitrogen, argon and other inert gases, so as to obtain the ideal heat treatment environment under the protection of the atmosphere. At present, it has been widely used in laboratory or small batch production of semiconductor, silicon nitride and other products.
气氛炉1
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