PLD pulse laser coating instrument
System composition:
Mainly composed of sputtering vacuum chamber, rotating target table, anti-oxidation substrate heating table, working gas path, exhaust system, installation machine, vacuum measurement and electronic control system.
Technical indicators:
Ultimate vacuum degree: ≤6.7×10 Pa
Recovering vacuum time: ≤20min from 1×10 Pa to 5×10 Pa
System leakage rate: 6. 7×10-7Pa.L/S;
Vacuum chamber: Ф300 spherical vacuum chamber,
Substrate size: 4″ can be placed to realize the target position scanning, etc. The substrate heating can be rotated continuously, the speed is 5-60 rpm, and the distance between the substrate and the evaporation source is 300-350mm adjustable.
Two-dimensional scanning mechanical platform, performs two-degree-of-freedom scanning, and the control content mainly includes target conversion, target rotation, sample rotation, sample temperature control, laser beam scanning, mass flow controller 1 channel
Baking temperature: 150℃ digital display automatic thermocouple temperature control (high temperature furnace plate, digital display automatic thermocouple temperature control can be heated to 800℃)
Used to prepare superconducting films, semiconductor films, ferroelectric films, superhard films, etc. Suitable for scientific research and small-batch preparation of thin film materials in colleges and universities and scientific research institutes.
